Soldering

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Soft soldering is characterized by the melting point of the filler metal, which is below 400 (752). The filler metal used in the process is called solder.Soldering is distinguished from brazing by use of a lower melting-temperature filler metal; it is distinguished from welding by the base metals not being melted during the joining process. In a soldering process, heat is applied to the parts to be joined, causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action. After the metal cools, the resulting joints are not as strong as the base metal, but have adequate strength, electrical conductivity, and water-tightness for many uses. Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia.Contents1 Applications 2 Solders 3 Flux 4 Basic soldering techniques 4.1 Methods 4.2 Electronic components (PCBs) 4.3 Pipe/mechanical soldering 4.4 Stained glass soldering 5 Desoldering and resoldering 6 Lead-free electronic soldering 7 Soldering defects 8 Tools 9 See also 10 References 11 External links // ApplicationsOne of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs). Another common application is making permanent but reversible connections between copper pipes in plumbing systems. Joints in sheet metal objects such as food cans, roof flashing, rain gutters and automobile radiators have also historically been soldered, and occasionally still are. Jewelry components are assembled and repaired by soldering. Small mechanical parts are often soldered as well. Soldering is also used to join lead came and copper foil in stained glass work. Soldering can also be used to effect a semi-permanent patch for a leak in a container cooking vessel.Guidelines to consider when soldering is that since soldering temperatures are so low a soldered joint has limited service at elevated temperatures. Solders generally do not have much strength so the process should not be used for load bearing members.Some examples of solder types and their applications are tin-lead (general purpose), tin-zinc for joining aluminium, lead-silver for strength at higher than room temperature, cadmium-silver for strength at high temperatures, zinc-aluminium for aluminium and corrosion resistance, and tin-silver and tin-bismuth for electronics.SoldersMain article: SolderSoldering filler materials are available in many different alloys for differing applications. In electronics assembly, the eutectic alloy of 63% tin and 37% lead (or 60/40, which is almost identical in performance to the eutectic) has been the alloy of choice. Other alloys are used for plumbing, mechanical assembly, and other applications.A eutectic formulation has several advantages for soldering; chief among these is the coincidence of the liquidus and solidus temperatures, i.e. the absence of a plastic phase. This allows for quicker wetting out as the solder heats up, and quicker setup as the solder cools. A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures. Any differential movement during the plastic phase may result in cracks, giving an unreliable joint. Additionally, a eutectic formulation has the lowest possible melting point, which minimizes heat stress on electronic components during soldering.Lead-free solders are suggested anywhere children may come into contact with (since children are likely to place things into their mouths), or for outdoor use where rain and other precipitation may wash the lead into the groundwater. Common solder alloys are mixtures of tin and lead, respectively:63/37: melts at 183 (361.4 ) (eutectic: the only mixture that melts at a point, instead of over a range) 60/40: melts between 183190 (361374 ) 50/50: melts between 185215 (365419 ) Lead-free solder alloys melt around 250 (482 ), depending on their composition.For environmental reasons, 'no-lead' solders are becoming more widely used. Unfortunately most 'no-lead' solders are not eutectic formulations, making it more difficult to create reliable joints with them. See complete discussion below; see also RoHS.Other common solders include low-temperature formulations (often containing bismuth), which are often used to join previously-soldered assemblies without un-soldering earlier connections, and high-temperature formulations (usually containing silver)...(and so on) To get More information , you can visit some products about ovulation test strips, stainless steel shot, . The White Color 5mm Ultra Bright flat head LED Lamp/LED Module with 1000-1500mcd Luminous Intensity products should be show more here!